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ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
THERMAL RESISTANCE (7)
Thermal Resistance, Junction to Ambient, Four-layer Board (2s2p)
Thermal Resistance, Junction to Board
Thermal Resistance, Junction to Ambient, Single-layer Board (1s) (8)
(9)
(10)
R ? JA
R ? JMA
R QJB
93
32
13.6
°C/W
°C/W
°C/W
Notes
7. The PVIN, SW, and PGND pins comprise the main heat conduction paths.
8. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
9. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal. There are thermal vias connecting the package to the two planes in the
board. (per JESD51-5)
10. Thermal resistance between the device and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
34716
Analog Integrated Circuit Device Data ?
6
Freescale Semiconductor
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